ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,849, issued on Nov. 3. "Power semiconductor package" was invented by Geza Dezsi (Durham, N.C.) and Yusheng Lin (Phoenix). According to the ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,850, issued on Nov. 3, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland). "Semiconductor power module and method for manufacturing a ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,851, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Laser assisted etching of dielectrics in IC devices" was invented... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,852, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method for manufactu... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,853, issued on Nov. 3, was assigned to Micron Technology Inc. (Boise, Idaho). "Molded memory assemblies for a system in package semiconducto... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,854, issued on Nov. 3, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taoyuan City, Taiwan). "Power chip package structure" was inve... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,856, issued on Nov. 3, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada). "Lid as... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,857, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor module with shaped external contact for... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,858, issued on Nov. 3, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Semiconductor device with an embedded active devi... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,859, issued on Nov. 3, was assigned to INTEL FOUNDRY IP LLC (Santa Clara, Calif.). "Three-dimensional stack cooling wings" was invented by S... और पढ़ें